SEOUL (XINHUA) – South Korea’s memory chip giant SK hynix said yesterday that it started to mass-produce the world’s first triple-level cell (TLC) 321-high 4D NAND Flash memory chip with one terabyte (TB) capacity.
The chipmaker noted that it became the world’s first supplier of the NAND with more than 300 layers by finding a technological breakthrough for stacking, planning to provide the 321-high products to customers from the first half of next year.
The NAND Flash products are categorised into single-, multi-, triple-, quadruple- and penta-level cells, depending on the amount of information in the format of bit unit that is stored in a cell. To stack more than 300 layers, SK hynix adopted the three plugs process technology that connects three plugs through an optimised follow-up process after three times of plug processes are finished.
