AFP – TSMC will open its latest chipmaking foundry on Japan’s Kyushu island on February 24, but a plant in the United States (US) will face further delays, the company said on Thursday.
TSMC controls more than half the world’s output of silicon wafers, used in everything from smartphones to cars and missiles.
On Thursday, during an investors’ call over fourth-quarter earnings, Chairman Mark Liu announced the official date of the long-awaited Japan foundry’s opening ceremony would be February 24.
“In Japan, we are building a special technology fab(rication plant) in Kumamoto which will utilise 12- and 16-nanometre and 28- and 22-nanometre process technology,” Liu said.
“We will hold an opening ceremony for this fab on February 24 next month and volume production is on track for fourth quarter (Q4) of 2024.”
He added that TSMC’s expansion overseas was “based on our customers’ needs and a necessary level of government subsidies for support”.